Whether you are working on radio-frequency integrated circuits (RFIC), monolithic microwave integrated circuits (MMIC), laminate, wafer-level packaging, antennas, or printed circuit boards (PCBs) the integration is becoming denser. This requires circuit simulation to be combined with 3D electromagnetic (EM) simulation to account for inevitable parasitic and coupling effects. Also, validating the system aspects is mandatory to expedite the development cycle.  

In this in-person seminar, we will address how Keysight's EDA software helps to overcome these challenges. The topics include: 

• Next generation electromagnetic simulation. 
• Accelerating the engineering lifecycle with AI/ML. 
• Simulating with 3D EM and scalable circuit models of SMD Parts. 
• Enabling heterogeneous integrated design.
• And more… 

Check out the detailed agenda and submit the form to reserve your seat.